PACK EXPO International: ETG Booth
| Fecha: | 03.11.2024 - 06.11.2024 |
| Lugar: | Chicago (IL), USA |
| Venue: | McCormick Place |
| Hall, Stand: | Lakeside Upper, 8045 |
| Tipo: | Tradeshow |
| Web address: | www.packexpointernational.com |
| Información adicional: |
ETG participates in the PACK EXPO International, the world’s most comprehensive packaging and processing event this year. Visit our EtherCAT experts at booth LU-8045 from November 3 - 6! |