KOSES is a semiconductor equipment manufacturer located at South Korea. KOSES experts will be available to present our latest equipment and process solutions for TMV, PoP and AP packages in back-end process with our high-end technology Solder Ball Mounting, Laser Cutting, Laser Drilling and Package Stack Systems. Laser Ablation System provides the latest technologies for PoP and/or DSM packages. High Position Accuracy with Pre-QC Vision Inspection to prevent mass rejection. The KOSES Solder Ball Attach System is the ideal solution for small solder ball, Micro ball to ball gap and Fine pitch packages. The world’s leading technology KOSES Laser Cutting can provide various types of Laser Source based on package characteristic for High Speed and High Precision Shape Cutting.