Founded in 1998, XACTIX, Inc. manufactures dry, highly selective isotropic etching systems (using XeF2) for etching Si, Ge, Mo and SiGe. They can also be used to selectively etch Ti, Ta, W, TiN and TaN. Popular applications for these systems are releasing and under cutting MEMS or NEMS, Failure Analysis, and removal of seed or barrier layers. With over a decade of experience, XACTIX is the overwhelming world leader for manufacturing dry isotropic etching systems using XeF2.