SAULTECH TECHNOLOGY

Saultech Technology Co., Ltd. develops precision pick-and-place, die-bonding and sorting systems for advanced packaging, including CoWoS, 3D IC and hybrid bonding. Its automation combines extreme alignment accuracy with high-volume throughput, helping foundries and OSATs build efficient packaging lines with lower total cost of ownership. Specialized bonding, vibration isolation and non-destructive handling support zero-defect production, ultra-thin dies, HBM and heterogeneous integration.